BERGQUIST SIL PAD TSP Q2500
FEATURES AND BENEFITS
Thermal impedance: 0.22ºC-in2 /W @ 50 psi
Maximum heat transfer
Aluminum foil coated both sides
Designed to replace thermal grease
TYPICAL APPLICATIONS
Between a transistor and a heat sink
Between two large surfaces such as an L-bracket and the chassis of an assembly
Between a heat sink and a chassis
Under electrically isolated power modules or devices such as resistors, transformers and solid state relays
BERGQUIST SIL PAD TSP Q2500 is a composite of aluminum foil coated on both sides with thermally/ electrically conductive Sil-Pad rubber. The material is designed for those applications in which maximum heat transfer is needed and electrical isolation is not required.
BERGQUIST SIL PAD TSP Q2500 is the ideal thermal interface material to replace messy thermal grease compounds. BERGQUIST SIL PAD TSP Q2500 eliminates problems associated with grease such as contamination of reflow solder or cleaning operations.
Unlike grease, BERGQUIST SIL PAD TSP Q2500 can be used prior to these operations. BERGQUIST SIL PAD TSP Q2500 also eliminates dust collection which can cause possible surface shorting or heat buildup.
TYPICAL PROPERTIES
Physical Properties
Hardness, Shore A, ASTM D2240 93
Flammability Rating, UL 94 V-0
Electrical Properties
Dielectric Breakdown Voltage , ASTM D149, Vac Non-Insulating
Dielectric Constant, ASTM D150 @ 1,000 Hz NA
Volume Resistivity, ASTM D257, ohm-meter 1×102
Thermal Properties
Thermal Conductivity , ASTM D5470, W/(m-K) 2.5
Thermal Performance vs. Pressure
TO-220 Thermal Performance, ºC/W
@ 10 psi 2.44
@ 25 psi 1.73
@ 50 psi 1.23
@ 100 psi 1.05
@ 200 psi 0.92
Thermal Impedance, ASTM D5470, ºC-in2 /W (1)
@ 10 psi 0.52
@ 25 psi 0.3
@ 50 psi 0.22
@ 100 psi 0.15
@ 200 psi 0.12