BERGQUIST GAP PAD TGP HC3000
FEATURES AND BENEFITS
- Thermal Conductivity: 3.0 W/m-K
- High-compliance, low compression stress
- Fiberglass reinforced for shear and tear resistance
BERGQUIST GAP PAD TGP HC3000 is a soft and compliant gap filling material with a thermal conductivity of 3.0 W/m-K.
The material offers exceptional thermal performance at low pressures due to a unique 3.0 W/m-K filler package and low-modulus resin formulation. The enhanced material is ideal for applications requiring low stress on components and boards during assembly.
BERGQUIST GAP PAD TGP HC3000 maintains a conformable nature that allows for quick recovery and excellent wet-out characteristics, even to surfaces with high roughness and/or topography. BERGQUIST GAP PAD TGP HC3000 is offered with natural inherent tack on both sides of the material, eliminating the need for thermally-impeding adhesive layers.
The top side has minimal tack for ease of handling. BERGQUIST GAP PAD TGP HC3000 is supplied with protective liners on both sides.
TYPICAL APPLICATIONS
- Telecommunications
- ASICs and DSPs
- Consumer electronics
- Thermal modules to heat sinks
TYPICAL PROPERTIES OF CURED MATERIAL
Physical Properties
Hardness, Shore 00, Thirty second delay value,
ASTM D2240, Bulk rubber 15
Heat Capacity, ASTM E1269, J/g-K 1.0
Density, Bulk rubber, ASTM D792, g/cc 3.1
Flammability, UL 94 V-0
Young's Modulus, ASTM D575 (1) kPa 110
(psi) (16)
Electrical Properties
Dielectric Breakdown Voltage , ASTM D149,
Minimum value @ 20 mil, VAC 5,000
Dielectric Constant, ASTM D150, 1,000Hz 6.5
Volume Resistivity, ASTM D257, ohm-meter 1×1010
Thermal Properties
Thermal Conductivity, ASTM D5470, W/(m-K) 3.0
Thermal Impedance, 0.040"(2)
ASTM D5470, ºC-in2 /W:
10% Deflection 0.57
20% Deflection 0.49
30% Deflection 0.44