Thermal management materials from Bergquist

Globally trusted Bergquist brand products have been in existence for over 50 years. Multiple award-winning formulations in a variety of media provide the heat dissipation needed for uses in a variety of markets, including automotive, consumer, telecom/datacom, power and industrial automation, computers, communications and many more.

As electronic systems integrate more functions into increasingly sophisticated, complex designs and more compact footprints, efficient thermal control is necessary to maximize performance and limit heat-related failures.

Henkel's Bergquist thermal management materials, including gap pads, gap fillers, SIL PADs, phase change materials, microTIMs, LIQUI FORM products and thermal adhesives, address today's toughest thermal control challenges.

Across all market sectors and applications, higher power, larger features, smaller footprints and higher power densities are driving the need for more effective heat dissipation solutions. Whether automotive batteries, motor drives and power electronics, or optical modules in modern hyperscale data centers, thermal control is critical for optimal, reliable operation.

When it comes to thermal interface materials and thermal control, Bergquist is among the most trusted brands on the market.

Get to know the wide portfolio and find the right solution for your application. We use Bergquist materials to produce ready-to-install stampings, tapes as well as molded parts. You can get a comprehensive overview of the product portfolio here.

BERGQUIST SIL PAD

There are two types of Sil Pads: 1. electrically insulating thin heat conducting foils and 2. non-electrically insulating thin heat conducting foils.

BERGQUIST SIL PAD: Electrically insulating thin pads

The thermally conductive insulating pads are a clean and effective alternative to mica, ceramics or greases for a wide variety of electronics applications. They provide excellent thermal conductivity, are more durable than mica, cleaner to process than thermal pastes, and extremely cost effective.

BERGQUIST SIL PAD: Non-electrically insulating thin pads.

These materials are designed for applications where maximum heat transfer is needed, but electrical insulation is not required. This makes SIL PAD the ideal thermal material to replace thermal conductive pastes.

Stamped parts made from SIL PAD

We manufacture stamped parts and strips from Silpad materials.

We supply the following SIL PAD materials:

Sil-Pad 1100ST (Soft Tack)
Sil-Pad 1200
Sil-Pad 1500ST (Soft Tack)
Sil-Pad 2000
Sil-Pad 400
Sil-Pad 800
Sil-Pad 900S
Sil-Pad 980
Sil-Pad A1500
Sil-Pad A2000
Sil-Pad K-10
Sil-Pad K-4
Sil-Pad K-6
BERGQUIST BOND-PLY adhesive tapes

BOND-PLY adhesive tapes are equipped with pressure-sensitive adhesives or can be laminated. They are thermally conductive and at the same time electrically insulating. BOND-PLY enables thermal and mechanical bonding of components with different expansion coefficients.

We supply the following BOND-PLY products:

Bond-Ply 100
Bond-Ply 400
Bond-Ply 660P
Bond-Ply 800
Bond-Ply LMS-HD
Die-cut parts from Bond-Ply adhesive tapes

We produce stamped parts and tapes from BOND-PLY adhesive tapes.

BERGQUIST GAP FILLER

GAP FILLER is supplied as a one- or two-component component, room or high-temperature curing system. The result is a soft, thermally conductive, form-in-place elastomer ideal for bonding electronic components on printed circuit boards to an adjacent metal housing or heat sink. Because Gap Filler is dispensed and wetted in a liquid state, the material creates virtually no stress on components during the assembly process.

We supply the following Gap Fillers:

Gap Filler 1000
Gap Filler 1000SR
Gap Filler 1100SF
Gap Filler 1400SL
Gap Filler 1500
Gap Filler 1500LV
Gap Filler 2000
Gap Filler 3500LV
Gap Filler 3500S35
Gap Filler 4000
BERGQUIST GAP PADs

GAP PADs provide effective thermal conduction and compensate for uneven surfaces, air gaps and surface roughness between heat sinks and electronic components. They provide high conformance to reduce contact resistance. GAP PADs reduce stress on electrical connections, dampen vibration and are compatible with automatic dispensing systems.

We supply the following Gappads:

Gap Pad 1000HD
Gap Pad 1000SF
Gap Pad 1450
Gap Pad 1500
Gap Pad 1500R
Gap Pad 1500S30
Gap Pad 2000S40
Gap Pad 2200SF
Gap Pad 2202SF
Gap Pad 2500S20
Gap Pad 3000S30
Gap Pad 3004SF
Gap Pad 3500ULM
Gap Pad 5000S35
Gap Pad A2000
Gap Pad A3000
Gap Pad EMI 1.0
Gap Pad HC 3.0
Gap Pad HC 5.0
Gap Pad HC1000
Gap Pad VO
Gap Pad VO Soft
Gap Pad VO Ultra Soft
Gap Pad VO Ultra Soft Black
Finished parts from GAP Pads

Finished parts from GAP pads

We process GAP pads on our plotters and punching machines into ready-to-install parts. These can be supplied as individual parts or on rolls.

BERGQUIST HI-FLOW Pads

HI-FLOW phase change materials are an optimal replacement for thermal conductive pastes as a thermal interface between a CPU or power component and a heat sink. The material changes from a solid to a viscous liquid at certain phase change temperatures to ensure complete wetting.

We supply the following Hi-Flow products:

Hi-Flow 105
Hi-Flow 225F-AC
Hi-Flow 225U
Hi-Flow 225UT
Hi-Flow 300G
Hi-Flow 300P
Hi-Flow 565U
Hi-Flow 565UT
Hi-Flow 625
Hi-Flow 650P
Finished parts from HI-FLOW pads

We process GAP pads on our plotters and punching machines into ready-to-install parts. These can be supplied as individual parts or on rolls.